TitleProduct

Panasonic SMT Chip Mounter NPM-D3

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Guangdong

  • Validity to:

    Long-term effective

  • Last update:

    2020-03-08 18:45

  • Browse the number:

    155

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Company Profile

SFG Electronic Technology Co., Limited

By certification [File Integrity]

Contact:songhuijd(Mr.)  

Email:

Telephone:

Phone:

Area:Guangdong

Address:Guangdong

Website:http://www.sfgsmt.com/ http://songhuijd.bn-faucet.com/

Product Details



Specification

Model ID

NPM-D3

Rear head
 Front head

Lightweight
16-nozzle head

12-nozzle head

8-nozzle head

2-nozzle head

Dispensing head

No head

Lightweight 16-nozzle head

NM-EJM6D

NM-EJM6D-MD

NM-EJM6D

12-nozzle head

8-nozzle head

2-nozzle head

Dispensing head

NM-EJM6D-MD


NM-EJM6D-D

Inspection head

NM-EJM6D-MA


NM-EJM6D-A

No head

NM-EJM6D

NM-EJM6D-D


PCB 

dimensions*1
(mm)

Dual-lane mode

L 50 x W 50 ~ L 510 x W 300

Single-lane
mode

L 50 x W 50 ~ L 510 x W 590

PCB
exchange
time

Dual-lane
mode

0 s* *No 0s when cycle time is 3.6 s or less

Single-lane
mode

3.6 s* *When selecting short conveyors

Electric source

3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA

Pneumatic source *2

0.5 MPa, 100 L /min (A.N.R.)

Dimensions *2 (mm)

W 832 x D 2 652 *3 x H 1 444 *4

Mass

1 680 kg (Only for main body:This differs depending on the option configuration.)

Placement head

Lightweight 16-nozzle head
(Per head)

12-nozzle head
(Per head)

8-nozzle head
(Per head)

2-nozzle head
(Per head)

High production mode [ON]

High production mode [OFF]

Max. speed

42 000 cph
(0.086 s/ chip)

38 000 cph
(0.095 s/ chip)

34 500 cph
(0.104 s/ chip)

21 500 cph
(0.167 s/ chip)

5 500 cph (0.655 s/ chip)
4 250 cph (0.847 s/ QFP)

Placement accuracy

     (Cpk□1)

± 40 µm/chip

±30 μm / chip
(±25 μm / chip*5)

±30 μm / chip

± 30 µm/chip
± 30 µm/QFP  
□ 12mm to 

□ 32mm
± 50
□ 12mm Underµm/QFP

± 30 µm/QFP

Component dimensions 

(mm)

0402 chip*6 to L 6 x W 6 x T 3

03015*6*7/0402 chip*6 to L 6 x W 6 x T 3

0402 chip*6 to L 12 x W 12 x T 6.5

0402 chip*6 to L 32 x W 32 x T 12

0603 chip to L 100 x W 90 x T 28

Component
supply

Taping

Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm


Taping

Max. 68 (4, 8 mm tape, Small reel)

Stick


Max.16 (Single stick feeder)

Tray


Max.20 (per tray feeder)

Dispensing head

Dot dispensing

Draw dispensing

Dispensing speed

0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)

4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8

Adhesive position accuracy
(Cpk□1)

± 75 μ m /dot

± 100 μ m /component

Applicable components

1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP

SOP,PLCC,QFP, Connector, BGA, CSP

Inspection head

2D inspection head (A)

2D inspection head (B)

Resolution

18 µm

9 µm

View size (mm)

44.4 x 37.2

21.1 x 17.6

Inspectionb processing
time

Solder
Inspection*9

0.35s/ View size

Component
Inspection*9

0.5s/ View size

Inspection
object

Solder
Inspection *9

Chip component : 100 μm x 150 μm or more (0603 mm or more)
Package component : φ150 μm or more

Chip component : 80 μm x 120 μm or more (0402 mm or more)
Package component : φ120 μm or more

Component
Inspection *9

Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10

Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10

Inspection
items

Solder
Inspection *9

Oozing, blur, misalignment, abnormal shape, bridging

Component
Inspection *9

Missing, shift, flipping, polarity, foreign object inspection *11

Inspection position accuracy *12
( Cpk□1)

± 20 μm

± 10 μm

No. of
inspection

Solder
Inspection *9



Component
Inspection *9



*1 :

Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established.

*2 :

Only for main body

*3 :

Dimension D including tray feeder : 2 683 mm
Dimension D including feeder cart : 2 728 mm

*4 :

Excluding the monitor, signal tower and ceiling fan cover.

*5 :

±25 μm placement support option.(Under conditions specified by Panasonic)

*6 :

The 03015/0402 mm chip requires a specific nozzle/feeder.

*7 :

Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip )

*8 :

A PCB height measurement time of 0.5s is included.

*9 :

One head cannot handle solder inspection and component inspection at the same time.

*10 :

Please refer to the specification booklet for details.

*11 :

Foreign object is available to chip components. (Excluding 03015 mm chip)

*12 :

This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions.

*Please refer to the specification booklet for details.

http://www.sfgsmt.com/